TY005-1
Classification:
Details
Product introduction
It is a composite matrix resin,widely used in the manufacturing of high performance composite materials,especially suitable for high temperature resistant copper claddings and high temperature resistant laminates and other manufacturing,can replace Kerimid701A polyimide resin.
Chemical description of product
It is a bismaleimide-based polyimide resin system,which does not contain DDM and other components in its chemical composition,and meets the requirements of green environmental protection.
Product features
High glass transition temperature and thermal stability;
Excellent solvent resistance;
Low thermal expansion coefficient(Cte,T-axis);
High peel strength of copper foil;
Good storage stability.
Use of the product
According to the use of solid content requirements,acetone and other organic solvents can be used for dilution.When pure resin is used to prepare copper-clad plates,it is diluted to 40-65%solid content by solvent at less than 80℃for use.Preparation and compatibility of brominated epoxy resin copper clad,joined the amount of brominated epoxy resin pure resin is less than or equal to 20%,and add the right amount of inorganic flame retardant Al(OH)3,under the condition of less than 80℃to solid content is 40-65%diluted with solvent,enhanced fiber(glass fiber,carbon fiber,etc.)preparation of presoak division,for the use of laminated products.
The final performance indicators achieved
Glass transition temperature(Tg) ≥250
Flame retardant(UL-94) HB/VI/VO
Copper foil peeling strength(IBS/In) ≥7
The mechanical properties,thermal stability and electrical properties are comparable to those of Kerimid701A.
Quality indicators
| appearance | content |
Gelation time （@171℃） |
| A brownish red viscous liquid |
60-80% |
200-600s |
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