Bismaleimide resin with low melting point (BMI-D)
Classification:
Details
Product Introduction
Modified by diphenylmethane bismaleimide, bismaleimide resin content of not less than 90%, hot melt in liquid resin (such as liquid epoxy, vinyl resin) to form a stable homogeneous system, can be widely used in high temperature epoxy solvent-free winding, drawing, casting, RMT molding process.
Product characteristics
Low melting point (about 60 ℃);
hot melt in liquid resin to form a stable homogeneous system;
substitute bismaleimide monomer;
Preparation into a variety of liquid resin-bisamt low viscosity eutectic.
Quality Index
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Project
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Indicators
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Appearance
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Brown red powder
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Melting point (DSC)℃
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60
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Application areas
Heat-resistant grade above 160 ℃ liquid epoxy solvent-free winding, drawing, casting, RMT and other composite molding process.
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