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Bismaleimide resin with low melting point (BMI-D)


Heat-resistant grade above 160 ℃ liquid epoxy solvent-free winding, drawing, pouring, RMT and other composite materials molding process

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Aliphatic bismaleimide

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4-methyl-1,3-phenyl bismaleimide (4-methyl-1,3-phenyl bismaleimide)

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Diallyl bisphenol A(Diallyl bisphenol A)