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Double horse type polyimide resin series
Modified polyphenylene ether resin series
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Modified organic urea promoter
Used for epoxy resin-dicyandiamide medium and low temperature curing carbon fiber composite materials, glass fiber reinforced plastic products, powder coating
Bismaleimide resin with low melting point (BMI-D)
Heat-resistant grade above 160 ℃ liquid epoxy solvent-free winding, drawing, pouring, RMT and other composite materials molding process
SEM-21
N,N-4, 4-Diphenylmethane Bismaleimide (N,N-4, 4-diphenylmethylene bismaleimide)
SEM-22
3,3-Dimethyl-5,5-diethyl-4,4-diphenylmethane bismaleimide (3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane bismaleimide)
SEM-23
Aliphatic bismaleimide
SEM-24
4-methyl-1,3-phenyl bismaleimide (4-methyl-1,3-phenyl bismaleimide)
SEM-25
Diallyl bisphenol A ether (Bisphenol A bisallyl ether)
SEM-26
Diallyl bisphenol A(Diallyl bisphenol A)
TY005-1
Polyimide resin (Polyimide resin)
705-292A/705-292B
SEM-12
Modified polyphenylene ether resin
SEM-13
Alkenyl modified polyphenylene ether resin
